What processor is used in the SolidRun i.MX 8M Plus SOM?

The SolidRun i.MX 8M Plus SOM is based on the NXP i.MX 8M Plus processor, featuring up to four Arm Cortex-A53 cores and a Cortex-M7 real-time processor for industrial and edge computing applications.

Does the i.MX 8M Plus SOM support AI and machine learning?

Yes. The module includes an integrated Neural Processing Unit (NPU) that delivers up to 2.3 TOPS, enabling machine learning and AI inference directly at the edge.

What AI applications can run on the i.MX 8M Plus SOM?

The SOM is suitable for computer vision, object detection, image classification, smart cameras, predictive maintenance, industrial automation, and edge AI applications.

Can the i.MX 8M Plus SOM run computer vision applications?

Yes. With its integrated NPU, image signal processor (ISP), and dual camera support, the module is designed for computer vision and intelligent imaging solutions.

Does the i.MX 8M Plus SOM support multiple cameras?

Yes. The module supports dual MIPI-CSI camera interfaces, making it ideal for machine vision and AI-powered camera systems.

Does the i.MX 8M Plus SOM support Linux?

Yes. The i.MX 8M Plus SOM supports Linux and is optimized for embedded Linux development and industrial IoT deployments.

What connectivity options are available on the i.MX 8M Plus SOM?

The module supports Gigabit Ethernet, PCIe, USB, Wi-Fi, and Bluetooth, depending on the selected configuration.

What industries is the i.MX 8M Plus SOM designed for?

The SOM is designed for industrial IoT, robotics, smart manufacturing, machine vision, healthcare devices, transportation, and edge AI applications.

Is the i.MX 8M Plus SOM suitable for robotics and automation?

Yes. The combination of AI acceleration, real-time processing, camera support, and industrial connectivity makes it well suited for robotics and automation systems.

Why choose the SolidRun i.MX 8M Plus SOM?

The SolidRun i.MX 8M Plus SOM combines AI acceleration, computer vision capabilities, industrial-grade reliability, Linux support, and flexible connectivity in a compact System-on-Module designed for edge AI and embedded applications.

i.MX95 System on Module

Up to 6 x Arm Cortex-A55, 1 x Cortex-M7, 1 x Cortex-M33

Integrated NPU (2.3 TOPs) for embedded AI/ML applications and edge inferencing
Quad to Hexa-core options with onboard WiFi/BT, eMMC, MIPI-CSI, LVDS and 10GbE.
Connect up to 2 MIPI cameras, 4K vision with HDR for detailed image processing

Specifications Documentation Carrier Boards Evaluation Kits Order Options

wdt_ID	Feature	Details	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at
1	CPU Name	NXP i.MX95 Hexa/Quad	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
2	CPU Type	Up to 6 x Cortex A55 1 x Cortex M7 1 x Cortex M33 1 x NPU up to 2.3 TOPS*	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
3	CPU Speed	Cortex A55 Cores Up to 2.0GHz Cortex M7 Core Up to 800MHz Cortex M33 Core Up to 333MHz	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
4	Floating Point	Armv8	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
5	SIMD	NEON 128-bit vectors	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
6	RAM	Up to 16GB LPDDR5/X	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
7	Internal Storage	Up to 128GB eMMC	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
8	External Storage Support	2x NVMe (PCIe x1 Gen 3 )	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
9	Ethernet	2 x 10/100/1000 Mbps with TSN 1 x 10Gbps with TSN	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
10	Wireless	802.11 b/g/n/ac + BT 5.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
11	GPU	Mali-G310 Valhall	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
12	3D GPU Support	OpenGL ES 3.2 Vulkan 1.3 OpenCL 3.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
13	AI Accelerator NPU	eIQ Neutron NPU Up to 2.3 TOPS	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
14	Video Decoder	H.264/ H.265	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
15	Video Encoder	H.264/ H.265	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
16	Display Interfaces	MIPI-DSI LVDS	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
17	Camera Interface	2x MIPI-CSI-2 (x4 lane D-PHY 2.5Gbps) Up to 8 cameras using MIPI virtual channels 500 Mpixel/s, 1x4Kp60 ISP	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
18	USB 2.0	1x USB 2.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
19	USB 3.0	1x USB 3.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
20	PCIe	2x PCIe Gen 3 (x1)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
21	I2C	8x shared (see pinout planner)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
22	SPI	1x XSPI + 5x SPI	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
23	UART	Up to 7x shared (see pinout planner)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
24	GPIO	74	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
25	PWM	4	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
26	CAN-FD	4	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
27	SD/eMMC	1x SDIO (x4)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
28	Embedded Linux	Linux	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
29	Size	47 x 30 mm	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
30	Interface	3 x Hirose DF40 connectors	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
31	Main Voltage	5V	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
32	I/O Voltage	1.8V	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
33	Temperature	Commercial: 0°C to 70°C Industrial: -40°C to 85°C Wide: -20°C to 85°C	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
34	Humidity	(non-condensing): 10% - 90%	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31

wdt_ID	Feature	Details	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at
1	CPU Name	NXP i.MX95 Hexa/Quad	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
2	CPU Type	Up to 6 x Cortex A55 1 x Cortex M7 1 x Cortex M33 1 x NPU up to 2.3 TOPS*	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
3	CPU Speed	Cortex A55 Cores Up to 2.0GHz Cortex M7 Core Up to 800MHz Cortex M33 Core Up to 333MHz	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
4	Floating Point	Armv8	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
5	SIMD	NEON 128-bit vectors	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
6	RAM	Up to 16GB LPDDR5/X	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
7	Internal Storage	Up to 128GB eMMC	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
8	External Storage Support	2x NVMe (PCIe x1 Gen 3 )	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
9	Ethernet	2 x 10/100/1000 Mbps with TSN 1 x 10Gbps with TSN	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
10	Wireless	802.11 b/g/n/ac + BT 5.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
11	GPU	Mali-G310 Valhall	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
12	3D GPU Support	OpenGL ES 3.2 Vulkan 1.3 OpenCL 3.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
13	AI Accelerator NPU	eIQ Neutron NPU Up to 2.3 TOPS	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
14	Video Decoder	H.264/ H.265	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
15	Video Encoder	H.264/ H.265	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
16	Display Interfaces	MIPI-DSI LVDS	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
17	Camera Interface	2x MIPI-CSI-2 (x4 lane D-PHY 2.5Gbps) Up to 8 cameras using MIPI virtual channels 500 Mpixel/s, 1x4Kp60 ISP	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
18	USB 2.0	1x USB 2.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
19	USB 3.0	1x USB 3.0	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
20	PCIe	2x PCIe Gen 3 (x1)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
21	I2C	8x shared (see pinout planner)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
22	SPI	1x XSPI + 5x SPI	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
23	UART	Up to 7x shared (see pinout planner)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
24	GPIO	74	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
25	PWM	4	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
26	CAN-FD	4	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
27	SD/eMMC	1x SDIO (x4)	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
28	Embedded Linux	Linux	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
29	Size	47 x 30 mm	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
30	Interface	3 x Hirose DF40 connectors	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
31	Main Voltage	5V	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
32	I/O Voltage	1.8V	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
33	Temperature	Commercial: 0°C to 70°C Industrial: -40°C to 85°C Wide: -20°C to 85°C	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31
34	Humidity	(non-condensing): 10% - 90%	Mona Ganem	21/10/2026 15:31	Mona Ganem	21/10/2026 15:31

SolidRun’s i.MX95 System on Module (SoM)

The SolidRun i.MX 95 System on Module combines the NXP i.MX 95 applications processor with an integrated 10GBASE-T Ethernet PHY. It provides a complete high-bandwidth networking subsystem on the module. With six Arm® Cortex®-A55 cores, the NXP eIQ® Neutron NPU and Time-Sensitive Networking on all Ethernet ports, it lets OEMs develop secure, deterministic, AI-enabled edge systems while reducing carrier board complexity.

i.MX95: Designed for Intelligent Edge AI and Seamless Integration

Integrated 10GBASE-T PHY: The SolidRun i.MX95 module features a Marvell® AQR113C multi-gigabit PHY with 10G / 5G / 2.5G / 1G / 100M auto-negotiation over standard copper cabling.

Three TSN-capable Ethernet ports: The module features 1× 10GbE and 2× 1GbE ports with on-module PHYs, supporting IEEE 1588 / 802.1AS synchronization, 802.1Qbv scheduled traffic, and 802.1Qci per-stream filtering.

Edge AI and vision: The module integrates an eIQ Neutron NPU delivering up to 2 TOPS, an image signal processor supporting up to 500 Mpixel/s, and H.265 / H.264 4Kp60 video encoding and decoding.

Industrial-grade operation and long-term availability: The module supports operating temperatures from −40 °C to +105 °C (Tj), benefits from NXP’s product longevity program, and is supported by a Linux BSP with long-term support.

Edge AI Computing with Integrated 10 Gigabit Ethernet
The module includes a complete 10 GbE subsystem with an on-module PHY. A 10GBASE-T port on the carrier board needs only magnetics and an RJ45 connector. The interface supports a range of high-bandwidth applications, from network uplinks and multi-camera streaming to integration with NVIDIA® edge AI platforms as a software-defined Holoscan Sensor Bridge endpoint. Two additional TSN-capable 1 GbE ports complete the network architecture.
Use Cases
- NVIDIA Holoscan Sensor Front-Ends: camera and sensor software defined aggregation endpoints that stream to Jetson and IGX platforms for physical AI, robotics, medical imaging and industrial inspection.
- Industrial Gateways and Edge Servers: 10 GbE uplink with TSN for consolidating control, sensor and video traffic.
- Machine Vision: multi-camera capture, on-device inference and high-bandwidth data transfer.
- Network and Security Appliances: high-throughput packet processing at low power.
- Robotics and Autonomous Mobile Robots: deterministic, high-bandwidth connectivity between sensors and compute.
- Transportation and Rail: rugged networked computing for onboard and wayside systems.

AI, Vision and Compute Performance
Six Arm Cortex-A55 cores and a real-time Arm Cortex-M7 core, together with the eIQ Neutron NPU, run inference close to the data source. The integrated image signal processor supports up to eight cameras over two 4-lane MIPI CSI-2 interfaces. An Arm Mali™-G310 GPU with Vulkan® 1.3 support drives LVDS and MIPI DSI displays. The I/O set includes two PCIe Gen 3 lanes, USB 3.0, four CAN FD interfaces and optional Wi-Fi 5 and Bluetooth 5.
Simplified Integration and Design Flexibility
The SolidRun i.MX95 System on Module integrates processing, high-speed networking, AI acceleration and essential connectivity into a compact 47 mm × 30 mm form factor. This modular approach helps OEMs reduce carrier board complexity, simplify hardware development and accelerate time to market. With industrial-grade operation, long-term product availability and a flexible interface set, the module provides a scalable foundation for embedded systems across industrial automation, machine vision, robotics and intelligent edge computing.

Related Articles & Videos

i.MX95 SoM and HummingBoard Press Release

Reference Manuals

NXP i.MX95 SOM Product Brief
Family Comparison Chart
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Tools

SolidRun Community Forums
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Carrier Boards

HummingBoard IIoT Product Brief
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OS Support

Linux Board Support Package
Yocto Board Support Package
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Mechanical

DXF Files
3D Files
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Product Compliance

REACH
RoHS
ISO 9001
EMC/EMI Regulations
UL 94
Green/ Halogen Free

	HUMMINGBOARD i.MX95 IIOT New
Processor	NXP i.MX95 System on Module Up to 6 x Cortex A55, 1 x Cortex M7, 1 x Cortex M33, 1 x NPU up to 2.3 TOPS*
Memory & Storage	Up to 16GB LPDDR5/X Up to 128GB eMMC MicroSD
AI Accelerator	2.3 TOPS
Display	MIPI-DSI LVDS
I/Os	2 x RS232, 2 x RS485, or RS232 + RS485, 4 x CAN-FD 1 x USB2.0, 1 x USB3.0 2 x MIPI-CSI 4 lanes
Networking	2 x 10/100/1000 Mbps with TSN 1 x 10Gbps with TSN 1 x 802.11 a/b/g/n/ac WiFi and Bluetooth 5.0 (2.4/5 GHz)
Misc.	GPIO RTC EEPROM
Power	7V – 32V PoE sink support 802.3at Reverse polarity support
Expansion card I/Os	M.2 B-Key LTE modem (eSIM, NanoSim)
Temperature	Industrial: -40°C to 85°C
Dimensions	PCBA: 88 x 135 mm
Enclosure	150 x 145 x 40mm
	Contact Us

	i.MX95 – IIOT Advanced Evaluation Kit	i.MX95 – IIOT Basic Evaluation Kit
	Contact Us	Contact Us
System on Modules (SoM)	NXP i.MX95 System on Module Up to 6 x Cortex A55, 1 x Cortex M7, 1 x Cortex M33, 1 x NPU up to 2.3 TOPS*	NXP i.MX95 System on Module Up to 6 x Cortex A55, 1 x Cortex M7, 1 x Cortex M33, 1 x NPU up to 2.3 TOPS*
Included Carrier Board	HummingBoard i.MX95 IIOT	HummingBoard i.MX95 IIOT
Dimensions	PCBA: 88 x 135 mm	PCBA: 88 x 135 mm
Display	MIPI-DSI LVDS	MIPI-DSI LVDS
I/Os	2 x RS232, 2 x RS485, or RS232 + RS485, 4 x CAN-FD 1 x USB2.0, 1 x USB3.0 2 x MIPI-CSI 4 lanes	2 x RS232, 2 x RS485, or RS232 + RS485, 4 x CAN-FD 1 x USB2.0, 1 x USB3.0 2 x MIPI-CSI 4 lanes
Touch Screen	Included MIPI-DSI or LVDS display The Evaluation kit comes with 7” touch display LVDS/ MIPI-DSI	N/A
MIPI CSI Camera	Optional IPF678MSR Camera Module	Optional IPF678MSR Camera Module
LTE Modem	Optional Global band LTE Cat4 module with GNSS	Optional Global band LTE Cat4 module with GNSS
Micro SD	SanDisk Memory Cards 16GB SDSDQAD-016G	SanDisk Memory Cards 16GB SDSDQAD-016G
Antenna WiFi/ BT	RF ANT 2.4GHZ/5.4GHZ FLAT PATCH	RF ANT 2.4GHZ/5.4GHZ FLAT PATCH
Universal Power adapter	12V/1A Power adapter with 4 plugs	12V/1A Power adapter with 4 plugs
Micro USB Cable	USB to Micro USB Cable	USB to Micro USB Cable
AI accelerator	2.3 TOPS	2.3 TOPS

Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your i.MX95 Configuration:

Part number structure
Fixed parameter	CPU Type	Cores option	WiFi/BT	Memory	eMMC	Revision	Temperature	PHY
SR	MP9	XX	WXX	D0XG	EXXX	V12	X	X

Options for parameters
Fixed parameter	CPU Type	Cores option	WiFi/BT	Memory	eMMC	Revision	Temperature	PHY
SR	MP9	HX = Hexa QD = Quad	W00 = Without WiFi/BT WB1 = Include WiFi/BT	D01G = 1GB D02G = 2GB D03G = 3GB D04G = 4GB D06G = 6GB D08G = 8GB	E000 = No eMMC E008 = 8GB E016 = 16GB E032 = 32GB E064 = 64GB	V10	C = Commercial I = Industrial	0 = 1x PHY 2 = 2x PHYs W = No x PHY