What is the SolidRun Bedrock RAI300?

The Bedrock RAI300 is a fanless industrial Edge AI computer powered by the AMD Ryzen™ AI 9 HX 370 processor. It combines a 12-core Zen 5 CPU, Radeon™ 890M GPU, and XDNA™ 2 NPU to deliver high-performance AI processing at the edge.

How much AI performance does the Bedrock RAI300 provide?

The Bedrock RAI300 includes an integrated AMD XDNA™ 2 NPU capable of delivering up to 50 TOPS of AI performance, making it suitable for AI inference, computer vision, and generative AI applications.

Is the Bedrock RAI300 suitable for Edge AI applications?

Yes. The Bedrock RAI300 is specifically designed for Edge AI workloads, enabling real-time AI inference, machine vision, analytics, and automation without relying on cloud connectivity.

What processor is used in the Bedrock RAI300?

The system is powered by the AMD Ryzen™ AI 9 HX 370 processor, featuring 12 Zen 5 CPU cores, 24 threads, and clock speeds up to 5.1 GHz.

Can the Bedrock RAI300 run Large Language Models (LLMs)?

Yes. With up to 128GB DDR5 memory, integrated AI acceleration, and AMD ROCm™ support, the Bedrock RAI300 can run many AI models and LLM workloads locally at the edge.

What operating systems does the Bedrock RAI300 support?

The Bedrock RAI300 supports Linux, Windows, and Windows IoT operating systems, providing flexibility for industrial and AI deployments.

Is the Bedrock RAI300 designed for machine vision applications?

Yes. The combination of a powerful CPU, Radeon GPU, AI NPU, high-speed storage, and industrial reliability makes it an excellent platform for machine vision and image processing systems.

What memory capacity does the Bedrock RAI300 support?

The system supports up to 128GB of DDR5 memory, allowing developers to run memory-intensive AI, analytics, and industrial workloads efficiently.

Can the Bedrock RAI300 operate in harsh industrial environments?

Yes. The Bedrock RAI300 features a rugged fanless design and supports operation in temperatures ranging from -40°C to 85°C, making it suitable for demanding industrial deployments.

Why choose the Bedrock RAI300 for industrial AI deployments?

The Bedrock RAI300 combines AMD Ryzen AI processing, up to 50 TOPS NPU performance, fanless operation, industrial temperature support, modular expansion options, and long-term availability in a compact platform optimized for Edge AI.

Can SolidRun customize the platform?

Yes. With a modular design and the SoM as the base of the system, SolidRun can quickly support different NIOs, Network I/O carrier boards, to match customer I/O, mechanical, and deployment requirements.

What is the usual lead time?

Sample lead time is usually 1–2 weeks, depending on configuration and availability.

What is the warranty?

The Bedrock RAI300 comes with a 3-year warranty.

Why is Bedrock RAI300 different from standard industrial Edge AI systems?

The Bedrock RAI300 offers one of the strongest size-to-performance ratios in compact fanless industrial Edge AI systems, combining Ryzen AI CPU/GPU/NPU performance, up to 128GB DDR5, up to 3 NVMe drives, modular internal board design, and rugged fanless construction.

Bedrock RAI300

1st industrial PC with the 12 core Zen5 AMD Ryzen™ AI 9 HX 370
Up to 128 GB DDR5 RAM and 50 AI TOPS NPU with AMD ROCm™ 7 support
State of the art thermal design for operation in -40ºC to 85ºC
10 years guaranteed availability

Product Brief Configure Bedrock Get A Quote Bedrock R8000

1 2 3 4 5 6 7 8

Overview Specifications Evaluate Bedrock Customize Bedrock Bedrock Resellers

AMD Ryzen AI 9 HX 370 – A Leap in Performance

Bedrock RAI300 is powered by the state-of-the-art AMD Ryzen AI 9 HX 370 processor with 12 Zen 5 cores and 24 threads running at up to 5.1 GHz, RDNA 3.5 iGPU, and the XDNA 2 NPU.

Unlock the Full Potential of Edge AI

Bedrock RAI300 leverages the AMD ROCm™ 7.x open software ecosystem to bridge the gap between cloud development and edge deployment, offering first-class ROCm support across both Windows and Linux. Integrated RDNA 3.5 and XDNA2 allows running leading AI frameworks natively, while the unified memory architecture of up to 128 GB enables execution at the edge of large-scale generative models and LLMs that were once restricted to the data center.

Packed Solid with Features

The I/O, storage and networking devices found in Bedrock RAI300 stand out in both performance and capacity. Thanks to its modular design Bedrock RAI300 is available with either 4 displays + 2 GbE or 4 GbE + 2 displays. Bedrock RAI300 is packed full with sockets for up to 128 GB DDR5, 3x NVME Gen4 2280 or up to 3 Hailo AI accelerators and 5G modem with dual SIM. I/O includes USB4 40 Gbps, extra 4 USB 3.2 ports and a console port. All these features are tightly packed in a compact fanless enclosure.

Remarkable Fanless Cooling

Hot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heat pipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size.

Full Control of CPU Power

With Bedrock RAI300 you don’t have to guess how much power the system draws. Instead you can precisely set CPU power limit across an exceptionally broad power range of 8W to 54W. This is particularly useful in scenarios where limited power has to be shared between the IPC and additional devices, and when integration constraints prevent ideal heat dissipation.

Rock Solid Reliability

Bedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems. DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation. RAM supports ECC. NVMe with power-loss-protection (PLP) can be ordered. Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM. The enclosure is extremely ruggedized – all-aluminum, fanless and ventless dust-resistant IP40.

Innovative Modular Design

Bedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:

SoM with the CPU, DDR5 and NVMe slots and all native interfaces on 380 pins of high density connectors.
Networking and I/O board (NIO) with NICs and ports.
Storage and Extension Cards board (SX) with slots for 5G modem and extra NVMe devices.
Power Module (PM) with DC to DC converter and DC input connector.

This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support.

Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volumes.

Painless Integration

The compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk.
SolidRun offers multiple types of mounting brackets, including lever-based DIN-Rail bracket with locking, wall mount, small stand and ruggedized stand.

Field Usability

As a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw.

The 0.6 liter Bedrock Tile

When integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible.
Bedrock Tile is designed for these use cases. The ribbed chassis walls are replaced with flat walls with blind threadings for fastening Bedrock Tile to a cold plate. A key feature of Bedrock Tile is that it preserves the 360º internal heat distribution so it can be cooled from either side. With thickness of just 29mm and volume of 0.6 liter, Bedrock Tile is easy to integrate in tight spaces. Having all connectors on one side further simplifies the integration.

Advanced Integration Using Deck

Some integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards). The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis.

Designing with Bedrock SoM

Bedrock SoM makes a convenient and flexible building block for board designers. For many developers, using Bedrock RAI300 SoM would be the best way to develop a custom appliance based on AMD Ryzen Ryzen AI 300 series. Bedrock SoM makes an attractive platform for that purpose for several reasons.
The SoM is far more self-contained than traditional SoMs. It has not only the essential CPU and RAM, but also NVMe, direct DC input with 12V – 19V tolerance and RTC battery. The SoM is provided in a ruggedized metal skirt that protects the SoM, provides mounting fixture for extension cards and serves as a heat-spreader for secondary heat sources. Copper heat-plate is pre-assembled on the CPU.
Customers wishing to develop with Bedrock SoM are welcome to contact SolidRun.

Feature	Specification	Notes
CPU	AMD Ryzen™ AI 9 HX 370 12C/24T Zen5 4nm Up to 5.1 GHz Up to 54W
GPU	AMD Radeon™ 890M	16 CU @ 2900 MHz
NPU	AMD Ryzen™ AI 50 TOPS
AI Acceleration	Up to 2x Hailo-8 M.2 AI Inferencing Acceleration Module 26 TOPS Up to 2x Hailo-10 M.2 Generative AI Acceleration Module 40 TOPS	2x M.2 key-M 2242 (each precludes an NVME)
RAM	128 bit DDR5 5600 up to 128 GB	2x SODIMM (2×32 bit each), conduction cooled
TPM	fTPM 2.0 (in Ryzen) + dTPM 2.0 (Infineon)	Select in BIOS
Display	Up to 4 display outputs HDMI 2.1 \| DisplayPort 2.1	Max resolution / refresh rate: 7680×4320 @ 60Hz 3840×2160 @ 240Hz
Storage	Up to 3x NVMe PCIe Gen4 x 4	M.2 key-M 2280 Optional power-loss-protection NVMe is conduction cooled Each 2nd/3rd NVMe precludes one Hailo-8 key-M
LAN	Up to 4x 2.5 GbE (Intel I226)	4x RJ45 (NIO R8000 4X25) \| 2x RJ45 (NIO R7000 Basic)
Modem	4G / 5G (Quectel)	Up to 4x SMA antennas Optional and upgradable (M.2 key-B 3042 / 3052)
USB	Up to 1x USB 4.0 40 Gb/s 1x USB 3.2 gen 2 10 Gb/s 3x USB 3.2 gen 2 5 Gb/s	Connectors: USB-C / USB-A
Console	Serial over USB	mini-USB connector
BIOS	AMI Aptio V	Dual SPI FLASH for redundancy Console redirection
Operating systems	Windows 11/IoT, Linux	Other x86 operating systems supported
Power	Up to 12V-60V DC	Phoenix terminal Other DC connectors available
Temperature range	Up to -40ºC to 85ºC	Also available in commercial temperature range
Enclosure	All aluminum enclosure, fanless cooling
Dimensions	60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting	DIN-rail, wall, VESA, table top

This form is for Bedrock RAI300 only.

To inquire about other SolidRun products: Click Here

Risk-Free Evaluation

Bedrock is a compact, high performance product that every customer is eager to try out! Take the opportunity to test it yourself!

Order Bedrock now, try it for 50 days.
If you are not pleased, send it back and get a refund^* for the product.

* Please note: Refund excludes used storage-device, used OS-license and shipping expenses.

First Name (required)

Last Name (required)

Email (required)

Phone

Country (required)

Company (required)

Website

Project description

Major requirements

What makes Bedrock RAI300 a suitable platform for the project

Would you like an evaluation unit?

Each Bedrock is tailored to the customer’s application. Bedrock is configured-to-order, assembled and tested accordingly.

Please use Bedrock RAI300 configuration selector to customize Bedrock.

Configure Bedrock

Click on a location tooltip to see more information about the reseller’s details.

Maps were disabled by the visitor on this site. Click to open the map in a new window.

Welpro SARL
https://welpro.biz/boutique/industrial-box-mini-pc/din-rail-embedded-pcs/bedrock-pc-r8000-r8x60/
Immeuble BAMA, 4eme Etage Bureau 21, ACI 2000, BAMAKO.
[email protected]
+223 90 02 60 02 / +223 82 02 70 02

Industrial Personal Computer 2U SARL
https://ipc2u.com/search/?q=SolidRun
Rue Des Iles Kerguelen Parc Edonia – Batiment M, 35760 Saint-Gregorie, France.
[email protected]
+33(0)230963006

Industrial Personal Computer 2U GmbH
https://ipc2u.de/search/?context=catalog&q=SolidRun
Frankenring 6, D-30855 Langenhagen, Germany.
[email protected]
+49 511 807259-0

Zentrica Ltd
https://www.zentrica.com/suppliers/embedded/solidrun/
Unit 8, City Business Centre, Hyde Street, Winchester, SO23 7TA, United Kingdom.
Tim Williams
[email protected]
01256 884999

Attractec.de
https://attractec.de/web/buy/ap-brk-101/
Mandel Straße 29, 10409, Berlin, Deutschland.
[email protected]
+49 (0)30 – 86 38 95 96

Attractec
https://attractec.com/web/bedrock/
Hagilad St. 25a, Yokneam, Israel.
[email protected]

PEILA INT S.R.L
https://www.peila-international.com/products/bedrock-r8000
Sector 1, 26-30 Constantin D. Aricescu St.,3rd floor Office 14 Ap.6 Room 2, Bucharest, Romania.
[email protected]

Peila Ltd
https://www.peila-international.com/categories/solidrun
Uri Lesser 8 Tel-Aviv, Israel.
[email protected]
03-5109955

StartIT Kft.
www.mini-pc.eu/en/bedrock-v3000
Keszeg utca 38. Vác 2600, Hungary.
István Pongrácz
[email protected]
[email protected]
+36 20 4489 581

RISC
https://www.risc.ch/index.php/
produkte/solidrun
Honerethof 6, Bergdietikon, 8962, Schweiz.
Heinz Rosenberg
[email protected]
+41 44 242 80 60

Assured Systems Americas
www.assured-systems.com/search/Bedrock/?post_type=product
1309 Coffeen Avenue, Ste 1200, Sheridan, WY 82801, USA.
James Priest
[email protected]
+ 1 347 719 4508

Assured Systems EMEA
www.assured-systems.com/search/Bedrock/?post_type=product
Unit A5, Douglas Park, Opal Way, Stone Business Park, Stone, Staffs, ST15 0YJ, UK.
James Priest
[email protected]
+ 44 1785 8790 50

YS TechSystems
www.ys-techsystems.com/bedrock-v3000/
Perach Alilah 189, Had Nes, Israel.
Shlomi Azar
[email protected]
+972 5426 99846

Nord Technology A/S
https://www.nordtechnology.dk/en/solidrun-launches-bedrock-r8000-future-proof-edge-ai/
World Trade Center, Borupvang 3, 2750 Ballerup, Denmark.
Kevin Peter Gade
[email protected]
+45 7027 0415

Things Embedded Limited UK
https://things-embedded.com/uk/solidrun/
7 Westover Drive, Stone, Staffordshire, ST15 8TT, United Kingdom
Andrew Whitehouse
[email protected]
UK: +44 7538 403 968

Things Embedded Limited USA
https://things-embedded.com/us/solidrun/
4117 Fairview Vista Point Apt. 104, Orlando, 32804 Florida
Andrew Whitehouse
[email protected]
US: +1 864 558 9087