SolidRun Launches Bedrock RAI300 – a Fanless Edge AI PC with 12 Core Zen 5 AMD Ryzen™ AI 9 HX 370 and AMD ROCm™ 7 Support

SolidRun has announced the first industrial PC based on the AMD Ryzen™ AI 9 HX 370 with support for the latest AMD ROCm™ 7 stack. The combination of high-performance Zen5 cores, Radeon iGPU, XDNA NPU and high memory capacity in a compact and ruggedized x86 device provides secure and robust edge AI processing capabilities.

AMD Ryzen^™ AI 9 HX 370 processor contains a 12C/24T Zen5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU. Up to 128 GB of DDR5 capacity allows for the local execution of large AI models.

Bedrock RAI300 is designed in the field-proven Bedrock form factor, exhibiting remarkable passive cooling capability which allows operation at full industrial temperature range of -40ºC to 85ºC. Bedrock RAI300 fits seamlessly into the modular ecosystem of the Bedrock family and can be configured using the same Networking & I/O boards (NIO), Storage & Extension boards (SX) and Power Modules (PM).

“Bedrock RAI300 brings performance enhancement across the board – in processing, graphics and AI.” said Irad Stavi, IPC Product Line Manager at SolidRun. “Existing Bedrock customers can upgrade seamlessly to Bedrock RAI300 at the same form factor and power envelope with full backward compatibility. For Edge AI applications, ROCm 7 is now supported in a ruggedized fanless and field-proven system with high performance, high capacity of memory and storage and rich and versatile I/O”.

Bedrock RAI300 Features

CPU power in Bedrock RAI300 can be precisely adjusted in BIOS in an extremely wide range between 8W – 54W. RAM and storage are modular with 2x SODIMMs supporting 128 GB DDR5 5600, and 3 NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.

Multiple I/O configurations are available including up to 4 displays comprising HDMI 2.1 + 3x DP 2.1, up to 4 2.5 Gbit Ethernet ports (Intel I226), optional LTE modem, USB4 type-C, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.

Bedrock RAI300 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.

The Bedrock RAI300, consistent with the entire Bedrock series, offers customers greater logistical flexibility in the current challenging market for RAM and storage by being available for order as a barebone unit.

Power, Mechanical and Thermal Design

Bedrock RAI300 electronic design is modular, SoM based. Power input is by an optional Power Module (PM) for supporting various deployment use cases. Three PM options are currently available 12V-24V, 12V-48V and 12V-60V.

The enclosure is made of heavy-duty machined aluminum with an anodized finish. It is offered in 2 variants – 1.6 liter for 60W and an 0.6 liter “Tile” variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket.

Bedrock RAI300 fanless design can handle up to 60W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices.
The system operates reliably at a temperature range of -40ºC to 85ºC.

Specifications

Feature
CPU	AMD Ryzen™ AI 9 HX 370
GPU	AMD Radeon™ 890M
NPU	AMD Ryzen™ AI 50 TOPS
RAM	128 bit DDR5 5600 up to 128 GB (2x SODIMM)
Display	4 display outputs HDMI 2.1 \| DisplayPort 2.1
Storage	3x NVMe PCIe Gen4 x 4
LAN	4x 2.5 GbE (Intel I226)
Modem	Modem: 4G / 5G (Quectel)
USB	1x USB 4.0 40 Gb/s, 1x USB 3.2 gen 2 10 Gb/s, 3x USB 3.2 gen 2 5 Gb/s
Console	Console: Serial over USB
BIOS	BIOS: AMI Aptio V
Operating systems	Operating systems: Windows 10/11/IoT, Linux
Power	12V-60V DC
Temperature range	-40ºC to 85ºC
Enclosure	Enclosure: All aluminum enclosure, fanless cooling
Dimensions	60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting	DIN-rail, wall, VESA, table top

For more information about the SolidRun Bedrock RAI300 and its feature set please visit:
https://www.solid-run.com/industrial-computers/bedrock-rai300/

Bedrock RAI300 Availability

Bedrock RAI300 is available immediately directly from SolidRun and from SolidRun’s Bedrock resellers.
For a quotation please visit: https://www.solid-run.com/industrial-computers/bedrock-rai300/#evaluate-bedrock

Media resources

Bedrock RAI300 Product Page

Block diagram

Media Gallery

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