HoneyComb Ryzen R8000

The HoneyComb Ryzen R8000 Mini-ITX Board is a powerhouse in a compact form.
Built for performance and reliability, it pairs AMD Ryzen R8000 CoM Express Type 6 Compact compute modules serving as fully deployable evaluation platform for our CEX6 Compact R8000 series modules. With dual 2.5GbE networking and up to 4x displays combined with powerful GPU and NPU for AI Inferencing, it’s ready to tackle modern industrial challenges in extreme conditions from -40°C to 85°C. Whether scaling applications or powering demanding tasks, this board delivers big capabilities in a small footprint.

HoneyComb R800 AMD Ryzen CoM6 (with Heatsink and fan)

All On One Board

The HoneyComb Ryzen R8000 is a Mini-ITX motherboard based on AMD Ryzen™ Embedded R8000 CoM6 Compact. Leveraging exceptional performance of the Ryzen R8000 CPU with Up to 8 Zen 4 cores/ 16 threads.
Integrated Radeon RDNA3 graphics (up to 6 WGPs), AMD XDNA NPU with up to 16 TOPS AI inferencing, Total processor performance scaling up to 39 TOPS. 

The HoneyComb Ryzen R8000 is a Mini-ITX motherboard based on AMD Ryzen™ Embedded R8000 CoM6 Compact. Leveraging exceptional performance of the Ryzen R8000 CPU with Up to 8 Zen 4 cores/ 16 threads.
Integrated Radeon RDNA3 graphics (up to 6 WGPs), AMD XDNA NPU with up to 16 TOPS AI inferencing, Total processor performance scaling up to 39 TOPS. 

Connectivity Options, Industrial Grade and Low Power

The HoneyComb Ryzen™ R8000 board enable HMIs and Vision AI and OEMs to flexibly scale their product portfolios across multiple performance and price points to meet their customers’ unique needs. Its connectivity capabilities include dual 2.5 GbE tu support modern industrial demands for reliable high speed networking to enable high speed sensors integration.

HoneyComb Ryzen R8000 layout

The HoneyComb Ryzen™ R8000 board enable HMIs and Vision AI and OEMs to flexibly scale their product portfolios across multiple performance and price points to meet their customers’ unique needs. Its connectivity capabilities include dual 2.5 GbE tu support modern industrial demands for reliable high speed networking to enable high speed sensors integration.

smart factory compressed

Use Cases

  • Industrial Automation & Control: High-performance processing and real-time I/O for PLCs, HMIs, and robotics.
  • Medical Imaging & Diagnostics: Advanced graphics and AI capabilities for visualization and analysis.
  • Edge AI & Machine Vision: Integrated NPU and GPU for inferencing at the edge with minimal latency.
  • Transportation & Smart Infrastructure: Compact, rugged design suited for embedded systems in harsh environments.
  • Digital Signage & Gaming: Multi-display support and high-end graphics for immersive experiences.
  • Industrial Automation & Control: High-performance processing and real-time I/O for PLCs, HMIs, and robotics.
  • Medical Imaging & Diagnostics: Advanced graphics and AI capabilities for visualization and analysis.
  • Edge AI & Machine Vision: Integrated NPU and GPU for inferencing at the edge with minimal latency.
  • Transportation & Smart Infrastructure: Compact, rugged design suited for embedded systems in harsh environments.
  • Digital Signage & Gaming: Multi-display support and high-end graphics for immersive experiences.

Related Articles

HoneyComb P100 and COMe6 Blog
HoneyComb P100 and COMe6 Press Release
SolidRun Amarisoft AMD Ryzen 2025 Blog
AMD Adaptive and Embedded Technology Day Bengaluru 2025
HoneyComb Ryzen V3000 blog
HoneyComb Ryzen V3000
SolidRun and Amarisoft Collaboration Press Release
SolidRun Amarisoft Collaboration PR
HoneyComb Ryzen R8000
Processor
COM 6 Compact Ryzen R8840U
Memory & Storage
1x M.2 NVME GEN 4×4
2x SATA 3.0
(Additional M.2 NVME 2x Gen4 on COM)
I/Os
1x USB 3.2 (10Gbps) and 3x USB 3.0 combined
into 2x Dual USB connectors
Networking
2x RJ45 2.5Gb NICs (one from COM and second on board)
Display
1x eDP 50 pin
2x mini DisplayPort
1x HDMI 2.0
Misc.
1x 4pin header with PWM and TACH
2x 4pin header ONLY 12v
Standard ATX PWR/LED header
CR2032 battery socket
2x USB 2.0 headers
COM GPI/GPO GPIO header
Development and Debug interfaces
Micro USB connector to FTDI for COM console
Power
Standard ATX connector
Expansion card I/Os

x16 PCIe connector with 8 active lanes.
Can be configured as 1×8 PCIe or 2×4 PCIe gen 4
Temperature
Commercial: 0°C to 70°C
Dimensions
Standard mini ITX 170 x 170mm
Reference Manuals

HoneyComb Ryzen R8000 Product Brief
HoneyComb Ryzen R8000 Block Diagram 
HoneyComb Ryzen R8000 Quick Start Guide
HoneyComb Ryzen R8000 Schematics  
Family Comparison Chart

Tools

SolidRun Community Forums
Pinout Planner Tool
SolidRun Community Forums
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool

Platform Highlights

Industry standard form factor CoM6 and mini-ITX
x.86 architecture
Industrial Grade, 10 year longevity
Power Efficient
detection
detection

OS Support

SW Support Package
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution

Linux – Distribution

Mechanical

DXF Files
3D Files
DXF Files
3D Files
DXF Files
DXF Files

Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your HoneyComb Ryzen R8000 configuration:

Part number structure
Fixed parameterCPU TypeSPIMemoryeMMCRevisionTemperatureHeatsink
SRAMD Ryzen R88XXX SXXDXXXEXXXVXXXX
Options for parameters
Fixed parameterCPU TypeSPIMemoryeMMCRevisionTemperatureHeatsink
SRCR840 = AMD Ryzen R8840US01 = 48MB D00G = No DDR E000 = No eMMC V10C= Commercial
I = Industrial
0 = No Heatsink
H = Heatsink
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