Ryzen AI Embedded P100 COM

COM Express Type 6 Compact Module, Ryzen AI Embedded P100 family

The AMD RYZEN™ AI EMBEDDED P100 CoM express 6 series delivers a powerful combination of performance, scalability, and rugged reliability, enabling OEMs and system integrators to fast-track next-generation, AI-enabled embedded solutions.

Advanced SoC Architecture: Integrates CPU, GPU, and NPU resources to provide balanced processing performance with efficient AI acceleration
Built on the 4nm “Zen 5/5c” architecture with powerful “RDNA 3.5” graphics and XDNA™ 2 AI Engines
Designed to withstand demanding industrial and automotive conditions with serviceable LPCAMM2 memory with screw-lock retention
Extended Lifecycle Support: Offers of up to 10 years of availability, backed by long-term software maintenance (LTS)

Specifications Documentation Evaluation Board Order Options

wdt_ID	Feature	Details	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at
1	CPU	Embedded Krackan2e / Pine Ridge P100 Series 6c - 12c (Zen5 / Zen5c)	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
2	Floating Point	256bit FPU	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
3	RAM	1x LPCAMM2 LPDDR5 Up to 9600 MT/s. Screw Lock secured.	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
4	Internal Storage	On COM M.2 2280 NVME	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
5	External Storage Support	NVME/SATA	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
6	Ethernet	1x 2.5Gbps Ethernet (Intel I226)	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
7	Security	dTPM 2.0 BMC ready	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
9	AI Accelerator NPU	50 TOPS	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
10	Display Interfaces	4x DP Optional eDP to LVDS (default eDP) Eval board - eDP+HDMI+2xminiDP	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
11	USB 2.0	4x USB 2.0	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
12	USB 3.0	1x USB 3.2 gen 2 10 Gb/s 3x USB 3.0 5Gb/s	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
13	PCIe	13x PCIe gen4 Additional 3x lanes optional with SATA/NVME/NIC	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
14	UART	2x UART	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
15	SATA	2x SATA 3.0	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
16	Operating Systems	Windows 10/11/IoT, Linux, Other x86 operating systems supported	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
17	Physical	Standard COM6 Comptact 95mm x 95mm	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
18	Interface	Per COMe6 Compact Standard	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
19	Main Voltage	Standard COM 12v with optional 5v standby	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
20	Temperature	CPU Commercial: 0°C to Junction 105°C CPU Industrial: -40°C to Junction 105°C All other components: -40° to 85°	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
21	Humidity	Humidity (non-condensing): 10% – 90%	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46

wdt_ID	Feature	Details	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at
1	CPU	Embedded Krackan2e / Pine Ridge P100 Series 6c - 12c (Zen5 / Zen5c)	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
2	Floating Point	256bit FPU	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
3	RAM	1x LPCAMM2 LPDDR5 Up to 9600 MT/s. Screw Lock secured.	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
4	Internal Storage	On COM M.2 2280 NVME	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
5	External Storage Support	NVME/SATA	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
6	Ethernet	1x 2.5Gbps Ethernet (Intel I226)	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
7	Security	dTPM 2.0 BMC ready	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
9	AI Accelerator NPU	50 TOPS	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
10	Display Interfaces	4x DP Optional eDP to LVDS (default eDP) Eval board - eDP+HDMI+2xminiDP	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
11	USB 2.0	4x USB 2.0	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
12	USB 3.0	1x USB 3.2 gen 2 10 Gb/s 3x USB 3.0 5Gb/s	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
13	PCIe	13x PCIe gen4 Additional 3x lanes optional with SATA/NVME/NIC	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
14	UART	2x UART	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
15	SATA	2x SATA 3.0	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
16	Operating Systems	Windows 10/11/IoT, Linux, Other x86 operating systems supported	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
17	Physical	Standard COM6 Comptact 95mm x 95mm	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
18	Interface	Per COMe6 Compact Standard	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
19	Main Voltage	Standard COM 12v with optional 5v standby	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
20	Temperature	CPU Commercial: 0°C to Junction 105°C CPU Industrial: -40°C to Junction 105°C All other components: -40° to 85°	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46
21	Humidity	Humidity (non-condensing): 10% – 90%	Mona Ganem	25/02/2026 09:46	Mona Ganem	25/02/2026 09:46

Ryzen AI Embedded P100 COM Express 6 Compact Module

The AMD Ryzen™ AI Embedded P100 Series combines powerful AI acceleration, high-performance compute, rugged reliability, and exceptional energy efficiency in a single embedded platform. At its core is the integrated XDNA™ 2 NPU, delivering up to 50 TOPS of AI inference performance—up to three times the capability of the Ryzen™ Embedded 8000 Series.

The Ryzen AI Embedded P100 COM Express 6 Compact Module enables real-time, on-device AI processing without reliance on cloud infrastructure, making it ideal for latency-sensitive, bandwidth-constrained, and security-critical deployments.

Overview
The AMD Ryzen™ Embedded P100 Series with COM Express Type 6 Compact Form Factor combines powerful AI acceleration, high-performance compute, rugged reliability, and exceptional energy efficiency in a single embedded platform. At its core is the integrated XDNA™ 2 NPU, delivering up to 50 TOPS of AI inference performance, up to three times the capability of the Ryzen™ Embedded 8000 Series and up to 12 Zen5 / Zen5c cores. This enables real-time, on-device AI processing without reliance on cloud infrastructure, making it ideal for latency-sensitive, bandwidth-constrained, and security-critical deployments.
A comprehensive I/O feature set—including PCIe® Gen4, 10GbE with TSN, and USB4®—ensures high-bandwidth connectivity for sensor fusion, industrial vision, and distributed computing architectures.
Compute and Vision Performance
Beyond AI acceleration, the P100 Series integrates advanced Zen 5 CPU cores and RDNA™ 3.5 graphics, significantly boosting both compute and visualization performance. With up to 35% greater GPU capability compared to previous generations, the platform supports smooth rendering for digital dashboards, sophisticated control interfaces, and graphics-intensive edge workloads.
In display and multimedia performance, the integrated graphics engine supports up to four 4K displays at 120 Hz or dual 8K displays at 120 Hz, enabling high-resolution, multi-display configurations. This makes it well suited for automotive cockpits, control rooms, and large-scale video wall installations that demand clarity and fluid motion.

Use Cases
The Ryzen™ AI Embedded P100 Series addresses a broad range of applications:
- In automotive systems, it powers next-generation digital cockpits, AI-enhanced infotainment, driver monitoring, and immersive multi-display dashboards with real-time graphics and local AI processing.
- In industrial automation, it supports industrial PCs, robotics controllers, smart cameras, and HMI platforms that require dependable real-time decision-making in demanding environments.
- Healthcare systems benefit from AI-accelerated imaging and monitoring in portable ultrasound and diagnostic equipment.
- In aerospace and defense, its rugged architecture and deterministic performance enable UAVs, signal intelligence platforms, and secure communications systems.
- Its strong multi-display and graphics capabilities also make it ideal for broadcasting, sports analytics, video walls, and advanced visual processing applications.
Rugged and Efficient Design
Designed for harsh environments, the P100 Series operates across an extended temperature range of –40°C to +105°C and offers up to 10 years of product longevity, along with full AEC-Q100 automotive qualification. These characteristics make it a strong fit for industrial, transportation, and aerospace applications requiring long-term durability and stability. With a configurable TDP range from 15W to 54W, it can be deployed in thermally constrained, fanless, or sealed systems while maintaining high compute density and real-time responsiveness.

Reference Manuals

Ryzen AI P100 CoM6 Product Brief
Ryzen AI P100 Hardware User Manual
Simplified Schematics
Simplified Schematics
Simplified Schematics
Simplified Schematics

Tools

SolidRun Community Forums
SolidRun Community Forums
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool

Carrier Boards

HoneyComb Ryzen AI P100 Product Brief
HoneyComb P100 Quick Start Guide
HoneyComb P100 Schematics
HummingBoard Ripple Schematics
HummingBoard Ripple Schematics
HummingBoard Ripple Schematics

OS Support

Yocto Board Support Package
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution

Mechanical

DXF Files
3D Files
DXF Files
3D Files
DXF Files
DXF Files

Product Compliance

REACH
RoHS
ISO 9001
EMC/EMI Regulations
UL 94
Green/ Halogen Free

	HoneyComb Ryzen AI Embedded P100
Processor	CoM Express 6 Ryzen P100
Memory & Storage	1x M.2 NVME GEN 4×4 2x SATA 3.0 (Additional M.2 NVME 1x Gen4 on COM)
I/Os	1x USB 3.2 (10Gbps) and 3x USB 3.0 combined into 2x Dual USB connectors
Networking	2x RJ45 2.5Gb NICs (one from COM and second on board)
Display	1x eDP 50 pin 2x mini DisplayPort 1x HDMI 2.0
Misc.	1x 4pin header with PWM and TACH 2x 4pin header ONLY 12v Standard ATX PWR/LED header CR2032 battery socket 2x USB 2.0 headers COM GPI/GPO GPIO header
Development and Debug interfaces	Micro USB connector to FTDI for COM console
Power	Standard ATX connector
Expansion card I/Os	x16 PCIe connector with 8 active lanes Can be configured as 1×8 PCIe or 2×4 PCIe gen 4
Temperature	Commercial: 0°C to 70°C
Dimensions	Standard mini ITX – 170 x 170mm
	Contact Us

Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your Ryzen P100 COM6 Compact Module Configuration:

Part number structure
Fixed parameter	CPU Type	SPI	Memory	eMMC	Revision	Temperature	Heatsink
SR	AMD Ryzen PXXX	SXX	DXXX	EXXX	VXX	X	X

Options for parameters
Fixed parameter	CPU Type	SPI	Memory	eMMC	Revision	Temperature	Heatsink
SR	P100 = AMD Ryzen P100	S01 = 48MB	D00G = No DDR	E000 = No eMMC	V10	C= Commercial I = Industrial	0 = No Heatsink H = Heatsink