Ryzen V3000 CX7 Computer on Module

COM Express Type 7, 8 Cores / 16 Threads, 1.9GHz base / 3.8GHz boost

  • Remarkable performance with 8 Core, 96 GB DDR5 ECC and 3x NVME Gen 4
  • Best-in-class connectivity with dual 10 GbE, 4x 2.5 GbE, 5G and WiFi 6E
  • 4 x USB 2.0, 4 x USB 3.2, 2 x SATA Gen3 6Gbps
  • Best performance per watt in its class
wdt_ID Feature Details
1 CPU AMD Ryzen V3C18I or AMD Ryzen V3C48 (Optional R7000 7840HS and R8000 8845HS headless with iGPU for compute only) 8 Cores / 16 Threads TDP 15W (V3C18I) / 45W (V3C48)
2 CPU Speed V3C18I: 1.9GHz base / 3.8GHz boost, V3C48: 3.3GHz base / 3.8GHz boost
3 RAM Up to 96GB (2 x 48GB), ECC/ Non-ECC DDR5, Up to 4800 MT/s (5600 MT/s for 7840HS and 8845HS) Via two SODIMM sockets
4 Networking On-board 1 x 2.5Gbe, 2 x 10GBASE-KR
5 Security Infineon TPM 2.0 (Optional, SPI based)
6 Watchdog Dedicated MCU
7 USB 2.0 4 x USB2
8 USB 3.0 4 x USB 3.2
9 PCIe x 20 lanes (Gen 4)
10 I2C 1
11 UART 2
12 SATA 2 x SATA Gen3 6Gbps (V3C18I and V3C48 only)
13 Operating Systems Windows or Linux
14 Size 125 x 95 mm, COM Express Type 7, 2 x 220 Pin COM headers, Total height (5mm mating height) 11.2mm
15 Interface COM Express Type 7 Headers
16 Main Voltage 9V-24V ( Standard 12V)
17 I/O Voltage 3.3V/1.8V
18 Temperature Commercial (CPU V3C48): 0°C to 70°C, Industrial (V3C18I): -40°C to 85°C
19 Humidity Humidity (Non-condensing): 10% – 90%
wdt_ID Feature Details
1 CPU AMD Ryzen V3C18I or AMD Ryzen V3C48 (Optional R7000 7840HS and R8000 8845HS headless with iGPU for compute only) 8 Cores / 16 Threads TDP 15W (V3C18I) / 45W (V3C48)
2 CPU Speed V3C18I: 1.9GHz base / 3.8GHz boost, V3C48: 3.3GHz base / 3.8GHz boost
3 RAM Up to 96GB (2 x 48GB), ECC/ Non-ECC DDR5, Up to 4800 MT/s (5600 MT/s for 7840HS and 8845HS) Via two SODIMM sockets
4 Networking On-board 1 x 2.5Gbe, 2 x 10GBASE-KR
5 Security Infineon TPM 2.0 (Optional, SPI based)
6 Watchdog Dedicated MCU
7 USB 2.0 4 x USB2
8 USB 3.0 4 x USB 3.2
9 PCIe x 20 lanes (Gen 4)
10 I2C 1
11 UART 2
12 SATA 2 x SATA Gen3 6Gbps (V3C18I and V3C48 only)
13 Operating Systems Windows or Linux
14 Size 125 x 95 mm, COM Express Type 7, 2 x 220 Pin COM headers, Total height (5mm mating height) 11.2mm
15 Interface COM Express Type 7 Headers
16 Main Voltage 9V-24V ( Standard 12V)
17 I/O Voltage 3.3V/1.8V
18 Temperature Commercial (CPU V3C48): 0°C to 70°C, Industrial (V3C18I): -40°C to 85°C
19 Humidity Humidity (Non-condensing): 10% – 90%

Ryzen V3000 CX7 Computer on Module

SolidRun’s Ryzen V3000 CX7 Computer-on-Module based on the COM Express Type 7 form factor was designed to provide a flexible, scalable & robust networking computing module. It offers the best MIPS/power ratio in the market as well as advanced support for user-space networking DPDK that transforms the platform into a high-end data plane machine.

With full virtualization capabilities, a range of connectivity options and high-end networking, the Ryzen V3000 CX7 module is well-positioned to support SDN/NFV solutions, and a wealth of other use cases such as access point, security gateway, mini edge server and more. This module offers a highly optimized power-price-performance ratio in comparison with competing x86 based COM Express modules on the market.

  • Overview

    AMD Ryzen™ Embedded V3000 COM7 brings the high-performance “Zen 3” CPU x86 core architecture to the V-Series portfolio, and deliver new levels of processing power, thermal efficiency and high-speed I/O connectivity in a compact, cost effective standard COM7. Providing seamlessly scalable module performance for a wide range of storage, networking and edge systems.

  • Fitting Embedded Landscape

    The COM Express module offered for both Commercial and Industrial grade applications support temperature range from low  -40°C up to high +85°C, outperforming low profile.
    Longevity commitment 10 years.
    AMD Ryzen™ Embedded V3000  are optimized for enterprise reliability in 24×7 operating environments with demanding workload requirements. 

  • Connectivity

    SolidRun AMD Ryzen V3000 COM7  is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with twenty PCIe Gen 4 lanes, two 10GBASE-KR interfaces, on board 2.5GbE PHY and up to 96GB dual-channel DDR5  (ECC/non-ECC) SO-DIMM. 
    The module PCB is ready to host special (Optional) accessories  support rugged  and extreme thermal environmental condition.

  • Target Applications

    SolidRun AMD Ryzen V3000 CX7 targets wide range of  embedded application such as server class applications engineered for tomorrow requirements:  Unmanned Aerial vehicles, autonomous driving, 5G Applications, communication systems, Rugged servers, Medical and AI applications.

Related Articles

The AMD Ryzen V3000 CX7 COM Article
The AMD Ryzen V3000 CX7 COM Press Release
MWC Event 2024
Unleashing the Power of Edge AI Processing Webinar. NXP, Hailo and SolidRun
SolidRun and Excelpoint Partnership
Bedrock R7000 Edge AI banner
AI Tech Day 01
Reference Manuals

AMD Ryzen V3000 CX7 Product Brief
AMD Ryzen V3000 CX7 HW User Manual
Simplified Schematics
Simplified Schematics
Simplified Schematics

Tools

SolidRun Community Forums
Pinout Planner Tool
SolidRun Community Forums
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool

Carrier Boards

HoneyComb Ryzen V3000 Product Brief
HoneyComb Ryzen V3000 QS Guide
HoneyComb Ryzen V3000 Schematics 

HummingBoard Ripple Schematics 
HummingBoard Ripple Schematics 
HummingBoard Ripple Schematics 

OS Support

SW Support Package
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution

Linux – Distribution

Mechanical

DXF Files
3D Files
DXF Files
3D Files
DXF Files
DXF Files

HoneyComb Ryzen V3000 no BMC
Development platform Ryzen V3000
Processor
V3C18I (Optional: V3C48, 7840HS, 8845HS)
8 Cores / 16 Threads / TDP 15W
1.9GHz base, 3.8GHz boost
Memory & Storage
Up to 96GB (2x 48GB)
ECC/non-ECC DDR5
Up to 4800 MT/s (5600 MT/s for 7840HS and 8845HS)
Via two SODIMM sockets
2x SATA 3
1x NVME (x4 gen 4)
I/Os
2x USB3.2
2x USB3.2 header
Networking
2x 10Gb SFP+
1x 2.5Gbe
Display
None
Misc.
1x I²C Bus | 1x SM Bus | 1x GPIO
BMC ( Baseboard Management Controller), Remote System Monitoring, Remote Power Control, Out-of-Band Management, Console Redirection, Event Logging, Security Features
Development and Debug interfaces
Serial port
Power
Standard ATX PSU
Expansion card I/Os
1x PCIe (1x 8 Gen4 or 2x 4 Gen4)
M.2 Key E
Temperature
Industrial: -40°C to 85°C
Dimensions
PCBA: 170 x 170mm

Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your Ryzen V3000 CX7 COM configuration:

Part number structure
Fixed parameterCPU TypeSPIMemoryeMMCRevisionTemperatureHeatsink
SRAMD Ryzen V3CXXXSXXDXXXEXXXV12XX
Options for parameters
Fixed parameterCPU TypeSPIMemoryeMMCRevisionTemperatureHeatsink
SRAMD Ryzen= V3C18
AMD Ryzen= V3C48
S01 = 48MBD00 = DDR5E000 = No eMMCV10C= Commercial
I = Industrial
0 = No Heatsink
H = Heatsink
Thank you for your message. It has been sent.

WE’D LOVE TO HEAR FROM YOU!

      WE’D LOVE TO HEAR FROM YOU!

        WE’D LOVE TO HEAR FROM YOU!


                Business Inquiries Form