Ryzen R8000 COM6 Compact Module

Name: Ryzen R8000 COM6 Compact Module
Brand: SolidRun

COM Express Type 6, Ryzen Embedded 8840U family 8C/16T Zen4, base clock 3.3GHz, boost up to 5.1GHz

SolidRun introduces a powerful new addition to its embedded computing portfolio: a COM Express Type 6 Compact module built around the AMD Ryzen Embedded 8000 Series. This module combines the already integrated in SolidRun’s Bedrock series of IPCs cutting-edge CPU, GPU, and AI capabilities with the flexibility and scalability of the COM Express standard ideal for industrial, medical, automation, and edge AI applications.

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Specifications Documentation Evaluation Board Order Options

wdt_ID	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at	Feature	Details
1	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	CPU	AMD Ryzen Embedded 8840U family 8C/16T Zen4, base clock 3.3GHz, boost up to 5.1GHz AMD Radeon 780M GPU with 12 core up to 2700MHz
2	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	CPU Speed	Base clock 3.3GHz, boost up to 5.1GHz
3	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	RAM	2x SO-DIMM DDR5-5600 with/without ECC
4	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Networking	1x 2.5Gbps Ethernet (Intel I226)
5	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Security	dTPM 2.0 BMC ready
7	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	USB 2.0	4x USB2
8	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	USB 3.0	1x USB 3.2 gen 2 10 Gb/s 3x USB 3.0 5Gb/s
9	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	PCIe	x16 lanes (Gen 4)
10	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	UART	2x UART
11	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	SATA	2x SATA Gen3 6Gbps (V3C18I and V3C48 only)
12	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Operating Systems	Windows or Linux
13	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Size	Standard COM6 Comptact 95mm x 95mm
15	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Main Voltage	Standard COM 12V with optional 5V standby
16	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	I/O Voltage	3.3V/1.8V
17	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Temperature	CPU Commercial: 0°C to Junction 105°C, All other componenets -40° to 85°
18	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Humidity	Humidity (non-condensing): 10% – 90%

wdt_ID	wdt_created_by	wdt_created_at	wdt_last_edited_by	wdt_last_edited_at	Feature	Details
1	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	CPU	AMD Ryzen Embedded 8840U family 8C/16T Zen4, base clock 3.3GHz, boost up to 5.1GHz AMD Radeon 780M GPU with 12 core up to 2700MHz
2	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	CPU Speed	Base clock 3.3GHz, boost up to 5.1GHz
3	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	RAM	2x SO-DIMM DDR5-5600 with/without ECC
4	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Networking	1x 2.5Gbps Ethernet (Intel I226)
5	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Security	dTPM 2.0 BMC ready
7	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	USB 2.0	4x USB2
8	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	USB 3.0	1x USB 3.2 gen 2 10 Gb/s 3x USB 3.0 5Gb/s
9	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	PCIe	x16 lanes (Gen 4)
10	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	UART	2x UART
11	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	SATA	2x SATA Gen3 6Gbps (V3C18I and V3C48 only)
12	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Operating Systems	Windows or Linux
13	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Size	Standard COM6 Comptact 95mm x 95mm
15	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Main Voltage	Standard COM 12V with optional 5V standby
16	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	I/O Voltage	3.3V/1.8V
17	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Temperature	CPU Commercial: 0°C to Junction 105°C, All other componenets -40° to 85°
18	Mona Ganem	20/11/2025 14:46	Mona Ganem	20/11/2025 14:46	Humidity	Humidity (non-condensing): 10% – 90%

Ryzen R8000 COM Express Type 6 Compact

SolidRun’s Ryzen R8000 COM Express Type 6 Compact form factor offers a balance of performance, power efficiency, and modularity. It enables faster time-to-market, simplified upgrades, and compatibility with a wide range of carrier boards and making it a future-proof choice for embedded system designers.

With full virtualization capabilities, a range of connectivity options and high-end networking, the Ryzen R8000 CoM Express Type 6 Compact Module is well-positioned to support SDN/NFV solutions, and a wealth of other use cases such as access point, security gateway, mini edge server and more. This module offers a highly optimized power-price-performance ratio in comparison with competing x86 based COM Express modules on the market.

Overview
AMD Ryzen Embedded 8000 Series with COM Express Type 6 Compact Form Factor is built for performance and versatility, this platform features up to 8 Zen 4 cores and 16 threads, integrated Radeon RDNA3 graphics with up to 6 WGPs, and an AMD XDNA NPU delivering up to 16 TOPS for AI inferencing, with total processor performance reaching 39 TOPS. Its compact 95 × 95 mm footprint is optimized for low- to mid-power SoCs (5–30W TDP) and ensures 10-year long-term availability. The design supports PCIe Gen 4, USB 4.0, SATA, and multiple display interfaces, making it ideal for modular system architectures and rapid deployment.
Integrated I/O and Expansion
This platform offers extensive connectivity with multiple PCIe lanes for high-speed peripherals, support for DisplayPort, HDMI, and LVDS/eDP, as well as USB 3.2, USB 2.0, and legacy serial interfaces. It features dual-channel DDR5 memory support and optional heat spreader or fanless cooling solutions.

Use Cases
- Industrial Automation & Control: High-performance processing and real-time I/O for PLCs, HMIs, and robotics.
- Medical Imaging & Diagnostics: Advanced graphics and AI capabilities for visualization and analysis.
- Edge AI & Machine Vision: Integrated NPU and GPU for inferencing at the edge with minimal latency.
- Transportation & Smart Infrastructure: Compact, rugged design suited for embedded systems in harsh environments.
- Digital Signage & Gaming: Multi-display support and high-end graphics for immersive experiences.
Rugged and Efficient Design
Designed for demanding environments, it supports industrial temperature ranges, direct DC input, and RTC battery functionality ensuring reliability and flexibility across a wide range of applications.

Industrial Automation Solutions Enabling Intelligence at the Edge1

Reference Manuals

Ryzen R8000 CoM6 Product Brief
Ryzen R8000 Hardware User Manual
Simplified Schematics
Simplified Schematics
Simplified Schematics

Tools

SolidRun Community Forums
SolidRun Community Forums
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool
Pinout Planner Tool

Carrier Boards

HoneyComb Ryzen R8000 Product Brief
HoneyComb R8000 Quick Start Guide
HoneyComb Ryzen R8000 Schematics
HummingBoard Ripple Schematics
HummingBoard Ripple Schematics
HummingBoard Ripple Schematics

OS Support

SW Support Package
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution
Linux – Distribution

Mechanical

DXF Files
3D Files
DXF Files
3D Files
DXF Files
DXF Files

Product Compliance

REACH
RoHS
ISO 9001
EMC/EMI Regulations
UL 94
Green/ Halogen Free

HoneyComb R800 AMD Ryzen CoM6 (with Heatsink and fan)

	HoneyComb Ryzen R8000
Processor	COM 6 Compact Ryzen R8840U
Memory & Storage	1x M.2 NVME GEN 4×4 2x SATA 3.0 (Additional M.2 NVME 2x Gen4 on COM)
I/Os	1x USB 3.2 (10Gbps) and 3x USB 3.0 combined into 2x Dual USB connectors
Networking	2x RJ45 2.5Gb NICs (one from COM and second on board)
Display	1x eDP 50 pin 2x mini DisplayPort 1x HDMI 2.0
Misc.	1x 4pin header with PWM and TACH 2x 4pin header ONLY 12v Standard ATX PWR/LED header CR2032 battery socket 2x USB 2.0 headers COM GPI/GPO GPIO header
Development and Debug interfaces	Micro USB connector to FTDI for COM console
Power	Standard ATX connector
Expansion card I/Os	x16 PCIe connector with 8 active lanes. Can be configured as 1×8 PCIe or 2×4 PCIe gen 4
Temperature	Commercial: 0°C to 70°C
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Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your Ryzen R8000 COM6 Compact Configuration:

Part number structure
Fixed parameter	CPU Type	SPI	Memory	eMMC	Revision	Temperature	Heatsink
SR	AMD Ryzen R88XXX	SXX	DXXX	EXXX	VXX	X	X

Options for parameters
Fixed parameter	CPU Type	SPI	Memory	eMMC	Revision	Temperature	Heatsink
SR	CR840 = AMD Ryzen R8840U	S01 = 48MB	D00G = No DDR	E000 = No eMMC	V10	C= Commercial I = Industrial	0 = No Heatsink H = Heatsink