i.MX8M Plus System on Module

Up to 4 x Arm Cortex-A53, 1 x Cortex-M7, up to 1.8GHz

  • Starting from $61
  • Integrated NPU (2.3 TOPs) for embedded AI/ML applications and edge inferencing
  • Dual to Quad-core options with onboard WiFi/BT, eMMC, MIPI-CSI, LVDS
  • Connect up to 2 MIPI cameras, 4K vision with HDR for detailed image processing
wdt_ID Feature Details
49 CPU NXP i.MX 8M Plus 4x Arm® Cortex®-A53 @1.8 GHz Commercial,1.6 GHz Industrial, 1x Arm® Cortex®-M7
50 RAM 4 GB LPDDR4, optional: 1 GB LPDDR4, 2 GB LPDDR4, 3 GB LPDDR4, up to 8GB LPDDR4
51 eMMC 8 GB, optional: Up to 64 GB
52 Ethernet 2x 10/100/1000 Mbps, 1x with TSN
53 Wireless 802.11 a/b/g/n/ac + BT 5.0
54 GPU Vivante GC7000UL
55 3D GPU Support OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1
56 Video Decoder 1080p60
57 Video Encoder 1080p60
58 USB 2X USB3.0
59 I/O Interfaces 3x UART, 3x I2C, 1x SPI, 1x PCIe(Gen 3.0), 75x GPIO, 4x PWM, 1x SD/eMMC, 1x S/PDIF
60 CAN 2x CAN FD
61 Display Interface HDMI 2.0, MIPI-DSI, LVDS
62 Camera Interface 1x MIPI-CSI2 (4 Lane), 2x ISP
63 B2B Connectors 3x Hirose DF40 connectors
64 External Storage Support SD, NVMe
65 Digital audio 18x I2S TDM, DSD512, 8-ch PDM Mic input, eARC ASRC, Low power voice accelerator: Cadence® Tensilica® HiFi 4 DSP @ 800 MHz
66 Supply Voltage 5V
67 I/O Voltage 3.3V/ 1.8V
68 Power Consumption <5W
69 Temperature Commercial: 0°C to 70°C, Industrial: -40°C to 85°C
70 Product Longevity 2036
71 Supported OS Embedded Linux (Yocto/Debian Distribution)
72 Form Factor Mezzanine, size 47 x 30 mm
wdt_ID Feature Details
49 CPU NXP i.MX 8M Plus 4x Arm® Cortex®-A53 @1.8 GHz Commercial,1.6 GHz Industrial, 1x Arm® Cortex®-M7
50 RAM 4 GB LPDDR4, optional: 1 GB LPDDR4, 2 GB LPDDR4, 3 GB LPDDR4, up to 8GB LPDDR4
51 eMMC 8 GB, optional: Up to 64 GB
52 Ethernet 2x 10/100/1000 Mbps, 1x with TSN
53 Wireless 802.11 a/b/g/n/ac + BT 5.0
54 GPU Vivante GC7000UL
55 3D GPU Support OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1
56 Video Decoder 1080p60
57 Video Encoder 1080p60
58 USB 2X USB3.0
59 I/O Interfaces 3x UART, 3x I2C, 1x SPI, 1x PCIe(Gen 3.0), 75x GPIO, 4x PWM, 1x SD/eMMC, 1x S/PDIF
60 CAN 2x CAN FD
61 Display Interface HDMI 2.0, MIPI-DSI, LVDS
62 Camera Interface 1x MIPI-CSI2 (4 Lane), 2x ISP
63 B2B Connectors 3x Hirose DF40 connectors
64 External Storage Support SD, NVMe
65 Digital audio 18x I2S TDM, DSD512, 8-ch PDM Mic input, eARC ASRC, Low power voice accelerator: Cadence® Tensilica® HiFi 4 DSP @ 800 MHz
66 Supply Voltage 5V
67 I/O Voltage 3.3V/ 1.8V
68 Power Consumption <5W
69 Temperature Commercial: 0°C to 70°C, Industrial: -40°C to 85°C
70 Product Longevity 2036
71 Supported OS Embedded Linux (Yocto/Debian Distribution)
72 Form Factor Mezzanine, size 47 x 30 mm

SolidRun’s i.MX8M Plus Computer-on-Module enables OEMs and integrators to create and deploy advanced and power-efficient solutions at the edge

Based on Arm Cortex A53 technology and manufacturing process utilizing 14LPC FinFET process, the NXP i.MX 8M Plus SoC provides high performance and processing speed, while keeping the power consumption to a minimum.

The built-in NPU (up to 2.3TOPs) provides customers the option to perform machine learning inference directly on the edge, reducing cloud dependency, latency and is able to perform highly complex neural network functions like face and emotion detection, object detection and surveillance, which are key to applications such as smart and safe cities, retail, smart home and much more.

Featuring additional high-speed interfaces such as 2 x Gigabit Ethernet, TSN, PCIe Gen 3, USB 3.0, and CAN-FD capabilities, offering industrial temperature grade and NXP’s longevity program, the i.MX8M Plus SOM is perfect for industrial IoT and HMI applications.

iMX8M Plus SoM Integrated machine learning accelerator that can process neural networks roughly thirty times faster than Arm® processor cores. NXP eIQ software includes inference engines, neural network compilers and optimized libraries.

Dual ISP and MIPI-CSI interfaces allow the i.MX8M Plus SOM to offer an intelligent and compact vision system for real-time image processing in high definition.

Industry 4.0 applications utilizing the built-in TSN capability for low latency and precise time synchronization. Create a real-time control process using the M7 core and CAN-FD interface for industrial applications.

Scale up or down between SolidRun’s i.MX8 product families that include the i.MX8M Plus / i.MX8M Mini / i.MX8M / i.MX8M Nano. Pin compatibility and shared software resources allow a flexible and forward-thinking approach for creating future proof products for demanding and low power applications.

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Processor
NXP i.MX 8M Plus Dual / Quad core Arm Cortex A53 up to 1.8GHz (with Arm M7 GPP)NXP i.MX 8M Plus Dual / Quad core Arm Cortex A53 up to 1.8GHz (with Arm M7 GPP)NXP i.MX8M Plus Dual / Quad core Arm Cortex A53 up to 1.8GHz (with Arm M7 GPP)
Memory & Storage
Up to 8GB LPDDR4
8GB eMMC
MicroSD
Up to 8GB LPDDR4
8GB eMMC
MicroSD
Up to 8GB LPDDR4
8GB eMMC
MicroSD
Display
HDMI
MIPI-DSI
HDMIHDMI
I/Os
2 x USB 3.0
1 x MIPI-CSI
1 x Digital audio (Riser interface FPC connector)
1 x Onboard audio codec
2 x USB 3.0
1 x MIPI-CSI
2 x USB 3.0
1 x MIPI-CSI
1 x Digital audio (Riser interface FPC connector)
1 x Onboard audio codec
Networking
2 x Ethernet RJ45 10/100/1000
1 x 802.11 a/b/g/n/ac WiFi and Bluetooth (2.4/5 GHz)
1 x Ethernet RJ45 10/100/1000
1 x 802.11 a/b/g/n/ac WiFi and Bluetooth (2.4/5 GHz)
2 x Ethernet RJ45 10/100/1000
1 x 802.11 a/b/g/n/ac WiFi and Bluetooth (2.4/5 GHz)
Misc.
1 x Reset button
1 x Configurable push button
3 x LED indicators
RTC
1 x Reset button
1 x Configurable push button
3 x LED indicators
RTC
1 x Reset button
1 x Configurable push button
3 x LED indicators
RTC
Development and Debug interfaces
Micro USBMicro USBMicro USB
Power
7V – 36V
PoE sink support 802.3af Class 0
7V – 36V7V – 36V
PoE sink support 802.3af Class 0
Expansion card I/Os
M.2
Mini Pcie with SIM holder
mikroBUS header
Mini Pcie with SIM holder
M.2 mPCIe – optional to connect with Hailo-8(for i.MX8M Plus)+E5 or nVME via PCIe interface
Mini Pcie with SIM holder
Temperature
Commercial: 0°C to 70°C
Industrial: -40°C to 85°C
Commercial: 0°C to 70°C
Industrial: -40°C to 85°C
Commercial: 0°C to 70°C
Industrial: -40°C to 85°C
Dimensions
PCBA: 100 x 70mm
Enclosure : 120 x 80 x 30mm
PCBA: 100 x 70mm
Enclosure : 120 x 80 x 30mm
PCBA: 100 x 70mm
Enclosure : 120 x 80 x 30mm
Enclosure
Extruded aluminumExtruded aluminumExtruded aluminum
i.MX8 Plus Kit
i.MX8M Plus Evaluation Kit
System on Modules (SoM)
NXP i.MX 8M Plus Quad, 1.8GHz, Cortex-A53 + Cortex-M7
4GB RAM, 8GB eMMC
2x GbE
Wi-Fi 802.11ac/a/b/g/n
Bluetooth 5.0
0 to 70°C
Included Carrier Board
HummingBoard Pulse / HummingBoard Pro
Micro SD
SanDisk Memory Cards 16GB SDSDQAD-016G
Antenna WiFi/ BT
RF ANT 2.4GHZ/5.4GHZ FLAT PATCH
Heatsink
iMX-8-SOM Heatsink
Universal Power adapter
12V/1A Power adapter with 4 plugs
Micro USB Cable
USB to Micro USB Cable
LTE Modem (Optional)
Quectel EC25A – LTE Cat 4 US / Quectel EC25E – LTE Cat 4 EU
Touch Screen (Optional)
“5″ HDMI / 7″ HDMI +
5V/3A Power adapter with 4 plugs +
USB to Micro USB Cable”
MIPI CSI Camera (Optional)
Basler daA3840-30mc camera with Lens and Cable
AI accelerator (Optional)
Hailo-8

Please use the template below to create the configuration you are interested in. Since there are many options for each SOM configuration it is not possible to keep all of them in stock, for this purpose SolidRun provides off the shelf configurations with high runner part numbers, please visit our shop to review all of them.

Choose your i.MX8M Plus configuration:

Part number structure
Fixed parameterCPU TypeCores optionWiFi/BTMemoryeMMCRevisionTemperatureFixed parameter
SRMP8XXWXXD0XGEXXXV12X0
Options for parameters
Fixed parameterCPU TypeCores optionWiFi/BTMemoryeMMCRevisionTemperatureFixed parameter
SRMP8DU = Dual
QD = Quad
W00 = Without WiFi/BT
WB1 = Include WiFi/BT
D01G = 1GB
D02G = 2GB
D03G = 3GB
D04G = 4GB
D06G = 6GB
D08G = 8GB
E000 = No eMMC
E008 = 8GB
E016 = 16GB
E032 = 32GB
E064 = 64GB
V12C = Commercial
I = Industrial
0

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