SolidRun Launches Bedrock R8000 – a Fanless IPC with AMD Ryzen™ Embedded 8000 for Generative AI and AI Inferencing at the Edge

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SolidRun has announced the world’s first industrial PC based on the new  AMD Ryzen Embedded 8000 series with support for multiple Hailo-10™ and Hailo-8™ AI accelerators. The combination of AMD Ryzen™ AI and Hailo AI accelerators enables unprecedented Generative AI and AI Inferencing capabilities of over 100 TOPS in a compact and ruggedized x86 edge device.

AMD Ryzen Embedded 8000 processor contains a 8C/16T Zen4 CPU (up to 5.1 GHz), Radeon 780M GPU with 6 WGPs/12 CU, a 16 TOPS NPU and AMD PRO technologies for enhanced security, manageability and reliability. Ryzen Embedded 8000 has an extended longevity of 10 years. Bedrock R8000’s unique modular design brings out the full range of the powerful I/O, including up to 96 GB DDR5-5600 ECC, x20 PCIe Gen 4, four 4K displays and dual USB4 40 Gbps.

Bedrock R8000 is designed in the highly-acclaimed Bedrock form factor, exhibiting remarkable passive cooling capability which allow operation at full industrial temperature range of -40ºC to 85ºC. Bedrock R8000 fits seamlessly into the modular ecosystem of the Bedrock family and can be configured using the same Networking & I/O boards (NIO), Storage & Extension boards (SX) and Power Modules (PM).
SolidRun is introducing with Bedrock R8000 new modules – NIO R8000 4X25 with 4x 2.5 GbE ports and USB4, and PM-1248 a cost effective power module supporting 12V-48V DC in.

“Edge AI is a rapidly-growing market that redefines hardware requirements.” said Irad Stavi, IPC Product Line Manager at SolidRun. “Bedrock R8000 stands out in addressing current and future requirements of Generative AI and AI Inferencing applications by offering best-in-class performance, unmatched scalability and modularity, reduced time-to-market thanks to standard PC operating systems, software stacks and devices, all in an extremely ruggedized, compact, energy efficient, field proven and cost effective platform. SolidRun is committed to continue enhancing the Bedrock ecosystem and will introduce more groundbreaking features later this year.”

Bedrock R8000 features

Bedrock R8000 is offered with AMD Ryzen Embedded 8845HS, AMD Ryzen™ 9 8945HS and other APUs in Ryzen 8000 “Hawk Point” family. CPU power can be precisely adjusted in BIOS in an extremely wide range between 8W – 54W. For Edge AI workloads, up to 3 AI accelerators can be installed with support for both the Generative-AI optimized Hailo-10 and AI-Inferencing optimized Hailo-8.

RAM and storage are modular with 2x SODIMMs supporting 96 GB DDR5 ECC/non-ECC, and 3 NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.

Multiple I/O configurations are available including up to 4 displays comprising HDMI 2.1 + 3x DP 2.1, up to 4 2.5 Gbit Ethernet ports (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, USB4 type-C, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.

Bedrock R8000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.

Power, mechanical and thermal design

Bedrock R8000 electronic design is modular, SoM based. Power input is by an optional Power Module (PM) for supporting various deployment use cases. Three PM options are currently available 12V-24V, 12V-48V and 12V-60V.

The enclosure is made of heavy-duty machined aluminum with an anodized finish. It is offered in 3 variants – 1.0 liter enclosure for dissipating up to 30W by convection, 1.6 liter for 60W and an 0.6 liter “Tile” variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket.

Bedrock R8000 fanless design can handle up to 60W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices.
The system operates reliably at a temperature range of -40ºC to 85ºC.

Specifications

Feature
CPU Ryzen Embedded 8845HS | Ryzen 9 8945HS | Ryzen Embedded 8840U
GPUAMD Radeon™ 780M
NPUAMD Ryzen™ AI 16 TOPS
AI Acceleration3x Hailo-8 26 TOPS | 2x Hailo-10 40 TOPS
RAM128 bit DDR5 5600 up to 96 GB ECC / non-ECC (2x SODIMM)
Display4 display outputs HDMI 2.1 | DisplayPort 2.1
Storage3x NVMe PCIe Gen4 x 4
LAN4x 2.5 GbE (Intel I226)
WLANWiFi 6E + BT 5.3 (Intel AX210)
Modem4G / 5G (Quectel)
USB1x USB 4.0 40 Gb/s, 1x USB 3.2 gen 2 10 Gb/s, 3x USB 3.2 gen 2 5 Gb/s
ConsoleSerial over USB
BIOSAMI Aptio V
Operating systemsWindows 10/11/IoT, Linux
Power12V-60V DC
Temperature range-40ºC to 85ºC
EnclosureAll aluminum enclosure, fanless cooling
Dimensions30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter
Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter”
MountingDIN-rail, wall, VESA, table top

For more information about the SolidRun Bedrock R8000 and its feature set please visit:  www.solid-run.com/fanless-computers/bedrock-r8000/

Bedrock R8000 Availability

Bedrock R8000 samples will be available in June 2024 with volume production in Q3’24.
For pricing information please visit: https://www.solid-run.com/industrial-computers/bedrock-r8000/#evaluate-bedrock

Bedrock R8000 is shown in AMD’s booth at Embedded World 2024 Nuremberg, 9-11 April.

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